Three Bond 3057B - UV- & wärmehärtender Harz (thixotrop) - 250 g Flasche

Three Bond 3057B adhesive overview

The Three Bond 3057B is a UV- and heat-curing resin with thixotropic consistency that is particularly suitable for spot-dosed bonding connections on electronic and housing components. The combination of UV curing and subsequent thermal exposure provides a robust bond with high mechanical strength and excellent insulation values.

As the Main component is Acrylic resin. The color of the material is milky white. The viscosity is approx. 18 Pa·s and the density approx. 1.43 g/cm³. The Shore D hardness is approx. 90, and the shear strength is approx. 15 MPa (varying depending on the component). The product provides a seconds tack under UV light, followed by a thermal post-curing, which enables higher strength and better insulation values.

Suitable for electronics assembly and sealing connections

Due to its spot-dispensing consistency, the resin is ideal for adhesive and sealing-relevant connections on electronic components as well as connection and housing parts. The thixotropic formulation reduces dripping and seepage losses, which is especially advantageous for vertical application sites.

Key properties of the 3057B resin

• Main component: Acrylic resin
• Color: milky white
• Viscosity (25 °C): approx. 18 Pa·s
• Density (25 °C): approx. 1.43 g/cm³
• Shore D hardness: approx. 90
• Shear strength: approx. 15 MPa
• Curing: UV-second tack with subsequent thermal curing

Construction: Acrylic resin-based adhesive bond

Main component

The resin is based on Acrylic resin as the central binding matrix, which in combination with the thixotropic formulation enables precise application and stable bonds.

Processing and practical tips

• Prepare surfaces thoroughly (clean, dry, free of grease).
• Apply the resin precisely at the bonding location, avoiding dripping.
• Expose the bonding areas briefly to UV light, followed by thermal curing according to component and process requirements.
• Check the bond for adhesion and seal integrity.

Temperature and insulation performance

Due to the combination of UV-curing and thermal post-curing, the resin achieves high mechanical strength and good insulation values – ideal for demanding electronic connections.