Three Bond 2202C - 1K Epoxidharz (Verguss-Kleben) - 1 kg Dose

Three Bond 2202C – 1K epoxy resin at a glance

The Three Bond 2202C is a one-component epoxy resin system that features a solvent-free formulation and clear suitability for electronics potting and bonding. The associated parent article is Three Bond 2202C; the article designation corresponds to "Three Bond 2202C - 1K epoxy resin (potting & bonding) - 1 kg can". The part number A20141 uniquely identifies the product. The formulation enables fast curing, even at low temperatures, with low shrinkage and excellent electrical as well as chemical properties, making it the ideal solution for sensitive electronic components.

The material belongs to the category epoxy adhesive and offers a core component of epoxy resin in a white, solvent-free matrix. These properties support reliable adhesion on typical substrates such as printed circuit boards, ceramics or metal surfaces and contribute to stable long-term processing.

Suitable for Electronics Potting & Bonding

The one-component epoxy resin system is suitable for both potting and bonding applications in electronic housings, PCBs and sensors. Thanks to the low viscosity in the intended application, the component remains easy to position, while the low shrinkage protects critical components. The excellent electrical insulation and chemical resistance minimize defects due to moisture or chemical exposure.

Technical Data

• Main component: Epoxy resin
• Color: White
• Viscosity (25 °C): 27 Pa·s
• Density (25 °C): 1.39 g/cm³
• Non-volatile Substances: >99%
• Shelf life: approx. 5 months

Notes on Properties

The material is solvent-free and shows a low-temperature-appropriate curing, which extends its use to sensitive electronic components. The electrical properties remain stable even under moisture, making it particularly suitable for potting and bonding tasks in demanding environments.