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Three Bond 2217H - 1K Epoxid SM Kleber - 1 kg Dose

Three Bond 2217H - 1K Epoxid SM Kleber - 1 kg Dose

Three Bond 2217H – 1K Epoxy SM Adhesive, 1 kg Can: fast SMT bonding, high solids content (>99%), low shrinkage.

Three Bond 2217H Epoxy Adhesive Overview

The 1K Epoxy SM Adhesive from Three Bond is formulated on an epoxy resin basis and is especially suitable for SMT applications. As a single-component adhesive, it simplifies handling, delivers a high solids load (>99%), and minimizes shrinkage, reducing bond distortions. The 1 kg can provides enough material for series assembly.

In practice, the adhesive provides short cycle times and high process reliability. The typical curing occurs at 80 °C in about 20 minutes, which supports an efficient production line. The adhesive is red and has a viscosity of about 196 Pa·s (25 °C) and a density of 1.25 g/cm³.

Applications in SMT Bonding

The adhesive is ideally suited for chip bonding and bonding SMT components onto printed circuit boards. Due to the high solids content and the low shrinkage, warp and mechanical stresses during temperature cycles are minimized.

Technical Data for Three Bond 2217H

  • Main component: Epoxy resin
  • Color: Red
  • Viscosity: 196 Pa·s (25 °C)
  • Density: 1.25 g/cm³ (25 °C)
  • Shelf life: 6 months
  • Shore D hardness: 87
  • Shear strength: 13 MPa
  • Curing time: 80 °C, approx. 20 minutes (typ.)
  • Peel strength: 0.8 kN/m

Properties & Benefits of the Adhesive Mass

The 1K Epoxy SM Adhesive offers easy handling, as no mixing is required. The high solids content (>99%) provides strong adhesion and minimized shrinkage, which counteracts bond distortions.

  • Short cycle times: typical curing process at 80 °C in about 20 min
  • High process reliability: reliable curing and low shrinkage
  • Color coding: red adhesive mass facilitates visual inspection

Processing & Practice of SMT Bonding

  1. Prepare surfaces clean and dry.
  2. Apply adhesive directly from the can.
  3. Position the component and secure it.
  4. Cure according to the data sheet (80 °C, approx. 20 min).

Composition of the Adhesive Mass

The adhesive is based on epoxy resin as the main component. The red color facilitates rapid visual inspection.

Temperature Stability and Mechanical Resistance

The joint exhibits a shear strength of 13 MPa and a peel strength of 0.8 kN/m. Shore D hardness 87 indicates good mechanical robustness, while the viscosity 196 Pa·s enables controlled application.

Product Properties

Hauptkomponente Epoxidharz
Farbe rot
Scherfestigkeit (MPa) 13
Aushärtungszeit 80?°C 20?min (typ.)
Lagerfähigkeit (Monate) 6
Shore?Härte D 87
Schälfestigkeit (kN/m) 0,8

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