Three Bond 2217H - 1K Epoxid SM Kleber - 230 g DEK PuM Print Kassette

Three Bond 2217H – 1K epoxy SM adhesive (A20150) overview

The Three Bond 2217H is a single-component epoxy adhesive for SMT applications. With a solid content >99 % it offers fast curing and low shrinkage, ideal for dense chip-to-chip connections.

The viscous consistency of about 196 Pa·s at 25 °C and a density of about 1.25 g/cm³ enable controlled application. Curing occurs at 80 °C typically in about 20 minutes, which supports short cycle times in the SMT process. The bond achieves a shear strength of about 13 MPa and a Shore hardness (D) of about 87. The shelf life is about 6 months.

Suitable for SMT applications

SMT Chip-on-Board Bonding

Thanks to the high solids load and good adhesion properties, the adhesive provides a reliable bonding solution when bonding chips on printed circuit boards. The red marking of the material supports visual inspections during component placement.

Contour and Surface Bonding

The viscous consistency enables precise dosing and even distribution over complex contours. This minimizes scrap and improves the surface finish on fine structures.

Dimensions and specifications of the adhesive

• Main component: Epoxy resin
• Color: Red
• Viscosity (25 °C): approx. 196 Pa·s
• Density (25 °C): approx. 1.25 g/cm³
• Shelf life: approx. 6 months
• Curing time (80 °C): approx. 20 minutes
• Shear strength: approx. 13 MPa
• Shore hardness (D): approx. 87

Core features of the epoxy adhesive

The high solids content enables short cycle times and robust adhesion. The red marking facilitates visual inspection in manufacturing. The low shrinkage supports stable connections even with tight spacing.

Application notes for SMT assembly

• Prepare surfaces according to process standards (degrease, keep dust-free).
• Apply adhesive in fine dots or line patterns with precision.
• Parts cure at about 80 °C for about 20 minutes; observe part- and material-dependent variations as needed.

Structure and labeling

Main component

Epoxy resin forms the base matrix of the adhesive.

Color

Red for identification in the production process.

Packaging

230 g cassette – DEK PuM Print.

Performance data at a glance

• Shear strength approx. 13 MPa
• Shore hardness approx. 87
• Shelf life approx. 6 months
• Curing at 80 °C approx. 20 minutes