Three Bond 2233H - 1K Epoxidharz (hoch TG) - 1 kg Dose

Epoxy Resin Three Bond 2233H at a Glance

The Three Bond 2233H is a 1K epoxy resin with high Tg and black color. It is supplied as a 1 kg can and is particularly suitable for adhesive and potting applications requiring temperatures up to about 135 °C.

It is characterized by low water absorption, high chemical resistance, and a solid content of >99%. With a viscosity of 35 Pa·s (25 °C) and a density of 1.21 g/cm³, it can be reliably processed. The hardness reaches Shore D 89 and the curing time at 120 °C is 50–80 s.

Applications

Adhesive and Potting Applications Based on Epoxy Resin

As a 1K epoxy resin, it is suitable where robust bonds and temperature resistance are required. The properties enable reliable adhesive and encapsulation systems in demanding environments.

Technical Data

• Color: Black
• Item number: A20153
• Main component: Epoxy resin
• Main category: Epoxy adhesive
• Category: Adhesive
• Viscosity at 25 °C: 35 Pa·s
• Density at 25 °C: 1.21 g/cm³
• Shear strength: 25.2 MPa
• Curing time 120 °C: 50–80 s
• Shore hardness: D 89
• Designation: Three Bond 2233H - 1K Epoxy Resin (high Tg) - 1 kg can

Properties & Benefits

• Low water absorption: Reliable bonds even in moisture.
• High chemical resistance: Resistance to many solvents.
• High solids content (>99%): Minimizes phase separation, increases mass per unit volume.
• High temperature resistance: Tg around 135 °C for temperature-critical applications.

Processing & Practice

As a 1K epoxy resin, it requires no mixing after opening, simplifying processing. The viscosity of approximately 35 Pa·s enables a uniform application.

Material & Structure

Based on an epoxy resin matrix with black coloring. Detailed composition is not available.

Special Features

High Temperature Resistance

The Tg is approximately 135 °C, enabling adhesive and encapsulation systems to withstand higher operating temperatures.

Compact 1K Formulation

The 1K formulation simplifies handling as no mixing is required, thereby increasing process reliability.