Three Bond 2270J - 1K Epoxidharz wärM eitend - 1 kg Metalldose

Epoxy adhesive Three Bond 2270J – 1K epoxy resin thermally conductive overview

The Three Bond 2270J is a 1K epoxy resin developed specifically for heat dissipation in electrical components. In practice it serves both as an adhesive and as a potting material for housings, contacts and component bonds.

The formulation offers very high thermal conductivity, low shrinkage and excellent electrical insulation, thereby reliably compensating temperature fluctuations and keeping stresses safely insulated.

Color: White • Main component: Epoxy resin • Parent article: Three Bond 2270J

Suitable for electronic components and potting applications

Bonding of components

As a 1K system, the adhesive can be easily applied and forms fast, strong bonds between housing components and metal parts. The low shrinkage minimizes post-cure distortion and the risk of stresses on sensitive connections.

Thermally conductive potting

Thanks to the thermal conductivity, heat is efficiently removed from components, increasing reliability in valve or enclosure applications. The white resin matrix provides optical neutrality and a good insulation level.

Technical data of the thermally conductive epoxy resin

• Color: White
• Viscosity at 25 °C: approx. 150 Pa·s
• Density at 25 °C: approx. 2.86 g/cm³
• Shelf life: approx. 6 months
• Shear strength: approx. 22.8 MPa
• Shore D hardness: approx. 88
• Curing time: approx. 50–80 s at 120 °C

Material & Composition

• Main component: Epoxy resin
• Parent article: Three Bond 2270J

Application notes

• Keep surfaces clean and dry, remove contaminants.
• Apply the resin in the required amount and assemble components.
• Cure at 120 °C for approx. 50–80 seconds until the adhesive sets.