Skip to main navigation Skip to main content Skip to page footer
Three Bond
Three Bond 2273E - 1K Epoxidharz (HF-Induktions-Cure) - 310 ml Kartusche

Three Bond 2273E - 1K Epoxidharz (HF-Induktions-Cure) - 310 ml Kartusche

Three Bond A20158 – 1K epoxy resin with HF induction cure, 310 ml. Solvent-free, ≥99% solids, low shrinkage, high electrical and chemical resistance.

Epoxy adhesive A20158 overview

The article A20158 belongs to the Three Bond 2273E family and offers a single-component epoxy resin system with HF induction cure. The 310 ml cartridge enables fast retrofits with controlled curing. The solvent-free resin system shows ≥99% solids, low shrinkage and excellent electrical and chemical resistance.

In typical applications, HF induction cure provides reliable curing. The color is white. The viscosity at 25 °C is approx. 70 Pa·s, the density approx. 1.16 g/cm³. The temperature range extends from -60 °C to 150 °C.

Curing occurs via HF induction at 150 °C in about 30 minutes. The hardness corresponds to approx. Shore D 84 and the shear strength is about 40 MPa.

Suitable for ferrite and steel parts

Due to HF induction hardening, the adhesive is ideal for joints on ferrite and steel parts. The solvent-free formulation is particularly suitable for electronics and machinery where a fast, durable adhesive bond is required.

Technical data of the A20158 epoxy adhesive

  • Viscosity at 25 °C: approx. 70 Pa·s
  • Density at 25 °C: approx. 1.16 g/cm³
  • Temperature range: -60 °C to 150 °C
  • Shore D hardness: approx. 84
  • Shear strength: approx. 40 MPa
  • Tg: 120 °C
  • Curing: HF induction cure at 150 °C approx. 30 min
  • Packaging: 310 ml cartridge
  • Shelf life: approx. 7 months

High solids and durability properties

This epoxy resin system is characterized by a single-component system, ≥99% solids and solvent-free. The minimal shrinkage ensures dimensionally stable adhesive joints, while high electrical and chemical resistance increases reliability in electronics and environments. The HF induction cure enables fast, controlled curing directly on the component.

Processing and practical application

  • Thoroughly clean and degrease surfaces.
  • Open cartridge and apply adhesive via the application channel.
  • Align components and prevent stresses or movements if necessary.
  • Perform HF induction cure at 150 °C for approx. 30 minutes.
  • Check post-curing and load components if intended.

Product Properties

Hauptkomponente Epoxidharz
Farbe weiss
Scherfestigkeit (MPa) 40
Aushärtungszeit 150?°C?30?min / HF?Induktion?Sek.
Lagerfähigkeit (Monate) 7
Shore?Härte D 84

Related products

Downloads