Three Bond 3301F - Elektrisch leitender Epoxid-Kleber - 200 g Dose

Three Bond 3301F – A20171 at a glance

The Three Bond 3301F is an electrically conductive epoxy adhesive in a 200 g can.

As an epoxy adhesive, it bonds substrates such as quartz and chip components through a conductive connection, supported by the silver component.

The thixotropy enables practical application without dripping and with good contour fidelity. The high adhesion ensures reliable connections even under thermal loading.

Quartz- and chip applications of the conductive epoxy adhesive

This product is particularly suitable for forming conductive connections in quartz and chip components and offers fast curing as well as good adhesion to ceramic substrates.

Adhesive data

• Color: Silver
• Density at 25 °C: approx. 3.04 g/cm³
• Curing: 170 °C, approx. 30 min
• Viscosity at 25 °C: approx. 23 Pa·s
• Shear strength: 9.2 MPa
• Main component: Epoxy + Silver
• Storage: shelf-stable at 5 °C

Key properties of the adhesive

• Conductivity: The silver component creates an electrically conductive connection for quartz and chip structures.
• Adhesion: High adhesion on ceramic substrates provides reliable connections.
• Thixotropy: Prevents dripping and supports contour-accurate application.

Adhesive composition

Composition: Epoxy resin with silver content forms the conductive bond, while the adhesive provides robust mechanical bonding.

Practical processing considerations

• Clean and degrease surfaces to maximize adhesion.
• Apply adhesive precisely and form contours.
• Cure according to data sheet: approx. 170 °C for about 30 min.
• After curing, check the equipment load and, if necessary, perform post-processing.