Three Bond 3301F - Elektrisch leitender Epoxid-Kleber - 500 g Dose

Electrically conductive epoxy adhesive Three Bond 3301F at a glance

The Three Bond 3301F is an electrically conductive epoxy adhesive with a silver-reinforcement structure, available in a 500 g can. The thixotropic consistency enables controlled application on quartz and chip surfaces, without spreading. The bond combines epoxy as a matrix with conductive silver particles for stable conductivity.

Particularly characteristic are very low resistance and high adhesion, making the adhesive suitable for demanding electronic components. The curing is temperature-controlled, supporting reliable long-term connections.

Suitable for conductive adhesive joints in electronics

Electronic assemblies

During the assembly of quartz, chips and other components, the adhesive provides conductive connections with stable adhesion on ceramic surfaces. The silver component ensures lasting conductivity even after moderate cycles.

Quartz & Chip encapsulations

Thanks to the thixotropic structure, the adhesive can be placed precisely and hardens reliably without smearing on surfaces — ideal for tightly dimensioned bonding areas in sensitive component regions.

Technical data of Three Bond 3301F

• Color: Silver
• Main component: Epoxy + Silver
• Shear strength: 9.2 MPa
• Curing: 170 °C / 30 min
• Storage: 5 °C

Features & Benefits

The system benefits from thixotropic consistency, which minimizes run-out in vertical applications and enables precise application. The combination of epoxy and silver provides high adhesion on chemically demanding surfaces such as quartz and chips, while the low resistance ensures reliable conductivity.

• Very low resistance enables efficient conduction paths
• High adhesion on ceramic substrates and metal surfaces
• Thixotropy minimizes displacement and run-off during vertical applications

Processing & Practical considerations

• Surface preparation: Perform cleaning and degreasing processes carefully.
• Adhesive application: Apply evenly and precisely, taking the material structure into account.
• Curing: At 170 °C for 30 minutes, then cool to relieve stresses.

Structure & Material Use

The epoxy matrix forms the bonding base, while silver as conductive filler enables the electrical connection. This combination is especially suitable for components that combine mechanical load with conductive connections.