Three Bond 2217H - 1K Epoxid SM Kleber - 20 ml Kartusche (verschiedene)

Three Bond 2217H Epoxy Adhesive Overview

The Three Bond 2217H is a 1K epoxy SM adhesive, packaged in a 20 ml cartridge and specifically suitable for SMT assembly. The short cycle times support fast assembly cycles for chip components or modules.

As the main component, epoxy resin is used. The color of the adhesive is red. The shelf life is 6 months, which enables planned material supply. The product is categorized as a bestseller among epoxy adhesives.

Typical curing conditions are at 80 °C for about 20 minutes (typical). The Shore D hardness is about 87; the shear strength is about 13 MPa, which supports a reliable bond in SMT environments. These properties contribute to short process times and minimize rework.

Suitable for SMT Applications

SMT Assembly

The SM adhesive provides a clear bond between chip components and printed circuit boards, suitable for fine structures and fast throughput, without excessive shrinkage.

Technical Data for Three Bond 2217H

• Main component: Epoxy resin
• Color: Red
• Shelf life: 6 months
• Shore hardness D: approx. 87
• Shear strength: approx. 13 MPa
• Curing time: 80 °C, approx. 20 min (typ.)
• Packaging: 20 ml cartridge

Features & Benefits

Due to the high solids content and low shrinkage, the positioning of sensitive components is stabilized during curing. The 1K formulation simplifies processing, reduces setup times and minimizes sources of error when bonding to printed circuit boards.

Processing & Practical Use

• Remove the cartridge and check the seal and dosing cup.
• Apply an even adhesive layer to the mounting interface.
• Leave the components in the SMT assembly and perform the heat treatment according to the specifications.