Three Bond 2274 - 1K Epoxidharz Underfiller (reparierbar) - 1 kg Dose

Three Bond 2274 – 1K epoxy underfill (reworkable) – 1 kg can (A20160)

The underfill Three Bond 2274 serves as a repairable underfill for electronic assemblies such as QFP, BGA and CSP. The formulation is solvent-free and enables a low-temperature curing, thereby minimizing heat damage to components.

As an epoxy resin–based material, it offers high strength and protects solder joints against shock and cycle stress. Components can also be desoldered during the repair process, making rework easier.

Suitable for QFP, BGA and CSP underfills

Electronics Assembly

The underfill meets typical requirements in electronics assembly: It prevents cavitation and supporting components during thermal cycling, protects solder joints and contributes to the reliability of the assembly.

Technical Data

• Main component: Epoxy resin
• Color: Black
• Viscosity at 25 °C: approx. 12 Pa·s
• Density at 25 °C: approx. 1.14 g/cm³
• Shelf life: 6 months
• Shore-D hardness: 86
• Shear strength: 11 MPa
• Curing: 60 °C approx. 180 min; 120 °C approx. 5 min
• Tg: approx. 65 °C

Key properties and benefits

The solvent-free formulation reduces emissions and facilitates compliance with requirements. The low-temperature curing enables short repair times without overloading components. The reparability supports component removal during rework, while the shock- and cycle-resistance reliably protects solder joints. The underfill strengthens the assembly and reduces mechanical stresses near sensitive connections.

Usage notes

This epoxy underfill material is specifically intended for QFP, BGA and CSP. After curing, components can be desoldered, enabling rework. Store the material in a cool and dry place to maintain shelf life and consistency.